DDR Memory

Product Description

DDR Memory
Specifications:
1) DDR 256, 333, 400MHz
2) 184-pin socket type dual in line memory module (DIMM)
3) 2.6V power supply
4) Data rate: 400Mbps (max. )
5) 2.5 V (SSTL-2 compatible) I/O
6) Double data rate architecture, two data transfers per clock
7) Bi-directional, data strobe (DQS) is transmitted/received with data, to be
Used in capturing data at the receiver
8) Data inputs and outputs are synchronized with DQS
9) DQS is edge aligned with data for READs, center aligned with data for WRITEs
10) Differential clock inputs (CK and CK)
11) DLL aligns DQ and DQS transitions with CK transitions
12) Commands entered on each positive CK edge, data referenced to both
Edges of DQS
13) Auto precharge option for each burst access
14) Programmable burst length: 2, 4, 8
15) Programmable/CAS latency (CL): 3
16) Programmable output driver strength: Normal/weak
DDR 533MHz-PC3200 180PIN 256MB 32*8/16*16 /TSOP PC /RETAIL PACKING
DDR 533MHz-PC3200 180PIN 512MB 64*8/32*8/32*16/TSOP /PC RETAIL PACKING
DDR 533MHz-PC3200 180PIN 128MB 16*8 /TSOP
PC RETAIL PACKING
DDR2 667MHz, 16X64/BGA /PC/RETAIL PACKING

Quality control

1. IC chipset test
IC chipsets we utilizes are only top grade from original brands, like HY, Samsung, Elpida, etc. When new IC chipsets are received, we randomly chose samples for test, approximately 10% to 20% ratio, on profestional test software---RST. Only if the samples are all withouth problem, this batch of ICs can be sent to the next test;
2. SPD infomration test of the Module
To check whether the SPD information is correct, we use two professional softwares, CPU-Z and Sisoft Sandra 2007, to separately test the module. During this procedure, we subject to internationl stardard AQL to pick samples.
3. Compatibility test of the Module
Samples which are picked according to AQL standard will be installed on more than 200 mainstream brands of motherboards, like Asus, Intel, etc.
4. Stability test
Pick samples according to AQL standard. Only after continous work WITHOUT CRASH for 48hours individually at 70 degrees centigrade and -10 degrees centigrade under big software like 3DMARKS, big games, etc, the Module can be sent out of the factory.